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HD74LS10P(E) Технические параметры
Renesas Electronics HD74LS10P(E) technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Logic - Gates and Inverters | |
| Марка | ||
| Surface Mount | NO | |
| Number of Terminals | 14Terminals | |
| ECCN (US) | EAR99 | |
| Logic Family | LS | |
| Number of Elements per Chip | 3Elements per Chips | |
| Number of Element Inputs | 3-INElement Input | |
| Number of Output Enables per Element | 0 | |
| Number of Selection Inputs per Element | 0 | |
| Number of Element Outputs | 1Element Output | |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 15@5V | |
| Absolute Propagation Delay Time (ns) | 15 | |
| Process Technology | Bipolar | |
| Maximum Low Level Output Current (mA) | 8 | |
| Maximum High Level Output Current (mA) | -0.4 | |
| Minimum Operating Supply Voltage (V) | 4.75 | |
| Typical Operating Supply Voltage (V) | 5 | |
| Maximum Operating Supply Voltage (V) | 5.25 | |
| Propagation Delay Test Condition (pF) | 15 | |
| Minimum Operating Temperature (°C) | -20 | |
| Maximum Operating Temperature (°C) | 75 | |
| Standard Package Name | DIP | |
| Supplier Package | PDIP | |
| Mounting | Through Hole | |
| Package Height | 5.06(Max) - 0.51(Min) | |
| Package Length | 19.2 | |
| Package Width | 6.3 | |
| PCB changed | 14 | |
| Lead Shape | Through Hole | |
| Package Description | DP-14 | |
| Package Style | IN-LINE | |
| Moisture Sensitivity Levels | 1 | |
| Load Capacitance (CL) | 15 pF | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | DIP14,.3 | |
| Operating Temperature-Min | -20 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 75 °C |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Rohs Code | Yes | |
| Manufacturer Part Number | HD74LS10P-E | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Renesas Electronics Corporation | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Risk Rank | 5.29 | |
| Part Package Code | DIP | |
| Prop. | 15 ns | |
| Pbfree Code | Yes | |
| Part Status | Obsolete | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Gates | |
| Technology | TTL | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 3Functions | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 14 | |
| JESD-30 Code | R-PDIP-T14 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 5 V | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Family | LS | |
| Logic Function | NAND | |
| Number of Inputs | 3Inputs | |
| Seated Height-Max | 5.06 mm | |
| Logic IC Type | NAND GATE | |
| Max I(ol) | 0.008 A | |
| Propagation Delay (tpd) | 15 ns | |
| Schmitt Trigger | NO | |
| Power Supply Current-Max (ICC) | 3.3 mA | |
| Width | 7.62 mm | |
| Length | 19.2 mm | |
| RoHS Status | RoHS non-compliant |
HD74LS10P(E) Документы
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