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- HM66AQB18202BP-50
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HM66AQB18202BP-50 Технические параметры
Renesas Electronics America HM66AQB18202BP-50 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 165Terminals | |
| Package Description | PLASTIC, FBGA-165 | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Number of Words Code | 2000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Access Time-Max | 0.45 ns | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | HM66AQB18202BP-50 | |
| Number of Words | 2097152 wordsWord | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Renesas Electronics Corporation | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Risk Rank | 5.92 | |
| Part Package Code | BGA | |
| JESD-609 Code | e0 | |
| ECCN Code | 3A991.B.2.A |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.32.00.41 | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 165 | |
| JESD-30 Code | R-PBGA-B165 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 2MX18 | |
| Seated Height-Max | 1.46 mm | |
| Memory Width | 18 | |
| Memory Density | 37748736 bit | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | QDR SRAM | |
| Width | 15 mm | |
| Length | 17 mm |
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