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- IDT72V01L15JG
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IDT72V01L15JG Технические параметры
Renesas Electronics America IDT72V01L15JG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Logic - FIFOs Memory | |
| Марка | ||
| Surface Mount | YES | |
| Mount | Surface Mount | |
| Number of Pins | 32Pins | |
| Number of Terminals | 32Terminals | |
| Manufacturer Part Number | IDT72V01L15JG | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | QFJ | |
| Package Description | QCCJ, LDCC32,.5X.6 | |
| Risk Rank | 5.56 | |
| Samacsys Description | IDT IDT72V01L15JG, FIFO Memory, Dual 4kbit, 512 x 9 bit, Bi-Directional 15ns, 3 u2192 3.6 V, 32-Pin PLCC | |
| Access Time-Max | 15 ns | |
| Clock Frequency-Max (fCLK) | 40 MHz | |
| Moisture Sensitivity Levels | 1 | |
| Number of Words | 512 wordsWord | |
| Number of Words Code | 512Words Codes | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC32,.5X.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Reflow Temperature-Max (s) | 30 | |
| RoHS | Compliant | |
| JESD-609 Code | e3 | |
| Pbfree Code | Yes | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) - annealed | |
| Max Operating Temperature | 70 °C | |
| Min Operating Temperature | 0 °C | |
| Additional Feature | RETRANSMIT |
| Свойство продукта | Значение свойства | |
|---|---|---|
| HTS Code | 8542.32.00.71 | |
| Terminal Position | QUAD | |
| Terminal Form | J BEND | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 32 | |
| JESD-30 Code | R-PQCC-J32 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Power Supplies | 3.3 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Max Supply Voltage | 3.6 V | |
| Min Supply Voltage | 3 V | |
| Memory Size | 512 B | |
| Element Configuration | Dual | |
| Operating Mode | ASYNCHRONOUS | |
| Supply Current-Max | 0.06 mA | |
| Access Time | 15 ns | |
| Data Bus Width | 9 b | |
| Organization | 512X9 | |
| Seated Height-Max | 3.55 mm | |
| Memory Width | 9 | |
| Standby Current-Max | 0.005 A | |
| Memory Density | 4608 bit | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | OTHER FIFO | |
| Bus Directional | Bidirectional | |
| Output Enable | NO | |
| Cycle Time | 25 ns | |
| Length | 13.97 mm | |
| Width | 11.43 mm | |
| Height | 2.79 mm |
Индекс :
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