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R7F7016503ABG-C#HC1 Технические параметры

Renesas Electronics Corporation  R7F7016503ABG-C#HC1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Mounting Type Surface Mount
Package / Case 233-FBGA
Supplier Device Package 233-FBGA (15x15)
Mfr Renesas Electronics Corporation
Number of I/Os 174I/Os
Data Converters A/D 38x10, 32x12b
Base Product Number R7F7016503
Series RH850/F1KM-S4
Packaging Tape & Reel (TR)
Operating Temperature -40°C ~ 105°C (TA)
Свойство продукта Значение свойства
Part Status Active
Oscillator Type Internal
Speed 240MHz
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Core Processor RH850G3KH
Peripherals DMA, LVD, PWM, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 3MB (3M x 8)
Connectivity CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
EEPROM Size 128K x 8
R7F7016503ABG-C#HC1 brand manufacturers: Renesas Electronics Corporation, Anli stock, R7F7016503ABG-C#HC1 reference price.Renesas Electronics Corporation. R7F7016503ABG-C#HC1 parameters, R7F7016503ABG-C#HC1 Datasheet PDF and pin diagram description download.You can use the R7F7016503ABG-C#HC1 Embedded - Microcontrollers, DSP Datesheet PDF, find R7F7016503ABG-C#HC1 pin diagram and circuit diagram and usage method of function,R7F7016503ABG-C#HC1 electronics tutorials.You can download from the Anli.