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PC755BMGU300LE Технические параметры
Rochester Electronics PC755BMGU300LE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microprocessors | |
| Марка | Rochester Electronics | |
| EU RoHS | Not Compliant | |
| ECCN (US) | 3A001.a.2.c | |
| HTS | 8542.31.00.01 | |
| Automotive | No | |
| PPAP | No | |
| Family Name | PowerPC 755 Processor | |
| Instruction Set Architecture | RISC | |
| Number of CPU Cores | 1CPU Core | |
| Data Bus Width (bit) | 32 | |
| Instruction Cache Size | 32KB | |
| Maximum Speed (MHz) | 300 | |
| UART | 0 | |
| USART | 0 | |
| Data Cache Size | 32KB | |
| Multiply Accumulate | No | |
| I2C | 0 | |
| I2S | 0 | |
| Minimum Operating Supply Voltage (V) | 1.8 | |
| Typical Operating Supply Voltage (V) | 2 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Maximum Operating Supply Voltage (V) | 2.1 | |
| I/O Voltage (V) | 2.5|3.3 | |
| Minimum Operating Temperature (°C) | -55 | |
| Maximum Operating Temperature (°C) | 125 | |
| Supplier Temperature Grade | Military | |
| Mounting | Surface Mount | |
| Package Height | 2.2(Max) | |
| Package Width | 25 | |
| Package Length | 25 | |
| PCB changed | 360 | |
| Standard Package Name | BGA | |
| Supplier Package | CBGA | |
| Lead Shape | Ball | |
| Part Status | Unconfirmed | |
| Pin Count | 360 | |
| Ethernet | 0 | |
| USB | 0 | |
| SPI | 0 | |
| CAN | 0 | |
| Device Core | PowerPC |
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