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BU8310AK Технические параметры
Rohm BU8310AK technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Interface - Controllers | |
| Марка | ||
| Mount | Surface Mount | |
| Surface Mount | YES | |
| Number of Terminals | 64Terminals | |
| RoHS | Compliant | |
| Package Description | QFP-64 | |
| Package Style | FLATPACK | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | QFP64,.66SQ,32 | |
| Operating Temperature-Min | -25 °C | |
| Reflow Temperature-Max (s) | 10 | |
| Operating Temperature-Max | 60 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | BU8310AK | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Manufacturer | ROHM Semiconductor | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROHM CO LTD | |
| Risk Rank | 5.66 | |
| Part Package Code | QFP | |
| Packaging | Bulk | |
| JESD-609 Code | e3/e2 | |
| Pbfree Code | Yes | |
| Terminal Finish | TIN/TIN COPPER |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Max Operating Temperature | 60 °C | |
| Min Operating Temperature | -25 °C | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Telephone Circuits | |
| Max Power Dissipation | 500 mW | |
| Technology | CMOS | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 64 | |
| JESD-30 Code | S-PQFP-G64 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3/5 V | |
| Temperature Grade | OTHER | |
| Number of Circuits | 1Circuit | |
| Operating Supply Current | 70 mA | |
| Supply Current-Max | 0.2 mA | |
| Seated Height-Max | 2.85 mm | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Width | 14 mm | |
| Length | 14 mm | |
| Lead Free | Lead Free |
Индекс :
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