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BRCD064GWZ-3E2 Технические параметры
Rohm Semiconductor BRCD064GWZ-3E2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Lifecycle Status | Production (Last Updated: 2 years ago) | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-XFBGA, CSPBGA | |
| Surface Mount | YES | |
| Supplier Device Package | UCSP35L1 | |
| Number of Terminals | 6Terminals | |
| Mfr | Rohm Semiconductor | |
| Product Status | Active | |
| Memory Types | Non-Volatile | |
| Base Product Number | BRCD064 | |
| Maximum Clock Frequency | 400 kHz | |
| Maximum Operating Temperature | + 85 C | |
| Supply Voltage-Max | 5.5 V | |
| Minimum Operating Temperature | - 40 C | |
| Factory Pack QuantityFactory Pack Quantity | 3000 | |
| Active Read Current - Max | 500 uA | |
| Supply Voltage-Min | 1.6 V | |
| Mounting Styles | SMD/SMT | |
| Interface Type | I2C | |
| Data Retention | 40 Year | |
| Part # Aliases | BRCD064GWZ-3 | |
| Manufacturer | ROHM Semiconductor | |
| Brand | ROHM Semiconductor | |
| RoHS | Details | |
| Package Description | VFBGA, | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Number of Words Code | 8000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | BRCD064GWZ-3E2 | |
| Clock Frequency-Max (fCLK) | 0.4 MHz | |
| Number of Words | 8192 wordsWord | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROHM CO LTD | |
| Risk Rank | 2.37 | |
| Series | - | |
| Operating Temperature | -40°C ~ 85°C (TA) | |
| Packaging | MouseReel | |
| Subcategory | Memory & Data Storage | |
| Voltage - Supply | 1.6V ~ 5.5V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.4 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | R-PBGA-B6 | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 1.6 V | |
| Memory Size | 64Kbit | |
| Operating Mode | SYNCHRONOUS | |
| Clock Frequency | 400 kHz | |
| Supply Current-Max | 0.5 mA, 2 mA | |
| Memory Format | EEPROM | |
| Memory Interface | I2C | |
| Organization | 8 k x 8 | |
| Seated Height-Max | 0.3 mm | |
| Memory Width | 8 | |
| Write Cycle Time - Word, Page | 5ms | |
| Product Type | EEPROM | |
| Density | 64 kb | |
| Memory Density | 65536 bit | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | EEPROM | |
| Serial Bus Type | I2C | |
| Write Cycle Time-Max (tWC) | 5 ms | |
| Product Category | EEPROM | |
| Memory Organization | 8K x 8 | |
| Width | 1 mm | |
| Length | 1.5 mm |
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