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K4B1G1646G-BCH9 Технические параметры

Samsung  K4B1G1646G-BCH9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка Samsung
Surface Mount YES
Number of Terminals 96Terminals
Package Description FBGA, BGA96,9X16,32
Package Style GRID ARRAY, FINE PITCH
Moisture Sensitivity Levels 3
Number of Words Code 64000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA96,9X16,32
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 0.255 ns
Rohs Code Yes
Manufacturer Part Number K4B1G1646G-BCH9
Clock Frequency-Max (fCLK) 667 MHz
Number of Words 67108864 wordsWord
Supply Voltage-Nom (Vsup) 1.5 V
Package Code FBGA
Package Shape RECTANGULAR
Manufacturer Samsung Semiconductor
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Risk Rank 8.58
JESD-609 Code e1
Свойство продукта Значение свойства
Pbfree Code Yes
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory DRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B96
Qualification Status Not Qualified
Power Supplies 1.5 V
Supply Current-Max 0.17 mA
Organization 64MX16
Output Characteristics 3-STATE
Memory Width 16
Standby Current-Max 0.01 A
Memory Density 1073741824 bit
I/O Type COMMON
Memory IC Type DDR DRAM
Refresh Cycles 8192
Sequential Burst Length 4,8
Interleaved Burst Length 4,8
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