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K4S643232H-UC60 Технические параметры
Samsung K4S643232H-UC60 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | Samsung | |
| Surface Mount | YES | |
| Number of Terminals | 86Terminals | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Moisture Sensitivity Levels | 3 | |
| Number of Words Code | 2000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | TSSOP86,.46,20 | |
| Reflow Temperature-Max (s) | 40 | |
| Access Time-Max | 5.5 ns | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | K4S643232H-UC60 | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| Number of Words | 2097152 wordsWord | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Samsung Semiconductor | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Risk Rank | 5.52 | |
| JESD-609 Code | e6 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Finish | Tin/Bismuth (Sn97Bi3) | |
| Subcategory | DRAMs | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PDSO-G86 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3.3 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Current-Max | 0.15 mA | |
| Organization | 2MX32 | |
| Output Characteristics | 3-STATE | |
| Memory Width | 32 | |
| Standby Current-Max | 0.002 A | |
| Memory Density | 67108864 bit | |
| I/O Type | COMMON | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Refresh Cycles | 4096 | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Interleaved Burst Length | 1,2,4,8 |
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