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M378B1G73BH0-CH9 Технические параметры

Samsung Electronics  M378B1G73BH0-CH9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) 4A994.a
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Max. Access Time (ns) 0.255
Maximum Clock Rate (MHz) 1333
Chip Configuration 512Mx8
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 880
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support No
Свойство продукта Значение свойства
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
SPD EEPROM Support Yes
Standard Package Name DIM
Supplier Package UDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 1Gx64
PLL No
Self Refresh Yes
Module Type 240UDIMM
RoHS Status RoHS Compliant

M378B1G73BH0-CH9 Документы

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