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M386A8K40BM1-CRC Технические параметры
Samsung Electronics M386A8K40BM1-CRC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Cards | |
| Марка | ||
| Surface Mount | NO | |
| Number of Terminals | 288Terminals | |
| ECCN (US) | 4A994.a | |
| HTS | 8473.30.11.40 | |
| Module | DRAM Module | |
| Module Density | 64Gbyte | |
| Number of Chip per Module | 36Chip per Modules | |
| Chip Density (bit) | 16G | |
| Data Bus Width (bit) | 72 | |
| Maximum Clock Rate (MHz) | 2400 | |
| Chip Configuration | 4Gx4 | |
| Chip Package Type | FBGA | |
| Typical Operating Supply Voltage (V) | 1.2 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 95 | |
| Supplier Temperature Grade | Commercial | |
| ECC Support | No | |
| Number of Ranks | QuadRank | |
| Number of Chip Banks | 16Chip Banks | |
| CAS Latency | 15 | |
| Supplier Package | LRDIMM | |
| Mounting | Socket | |
| PCB changed | 288 | |
| Maximum Clock Rate | 2400(MHz) | |
| Operating Temperature (Max.) | 95C | |
| Total Density | 64GBYTE(b) | |
| Operating Temperature Classification | Commercial | |
| Package Type | LRDIMM | |
| Operating Temp Range | 0C to 85C | |
| Number of Elements | 36 Elements | |
| Device Core Size | 72(b) | |
| Operating Supply Voltage (Typ) | 1.2(V) | |
| Rad Hardened | No | |
| Operating Temperature (Min.) | 0C | |
| Main Category | DRAM Module | |
| Package Description | DIMM, |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Number of Words Code | 8000000000Words Codes | |
| Package Body Material | UNSPECIFIED | |
| Manufacturer Part Number | M386A8K40BM1-CRC | |
| Number of Words | 8589934592 wordsWord | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Package Code | DIMM | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Samsung Semiconductor | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Risk Rank | 5.81 | |
| Part Status | LTB | |
| ECCN Code | EAR99 | |
| Additional Feature | AUTO/SELF REFRESH; WD-MAX | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.85 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 288 | |
| JESD-30 Code | R-XDMA-N288 | |
| Supply Voltage-Max (Vsup) | 1.26 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Number of Ports | 1Port | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 8Gx72 | |
| Seated Height-Max | 31.4 mm | |
| Memory Width | 72 | |
| Memory Density | 618475290624 bit | |
| Memory IC Type | DDR DRAM MODULE | |
| Access Mode | FOUR BANK PAGE BURST | |
| Self Refresh | YES | |
| Module Type | 288RDIMM | |
| Width | 3.9 mm | |
| Length | 133.35 mm | |
| RoHS Status | Yes with exemptions |
M386A8K40BM1-CRC Документы
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