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M386A8K40BM1-CRC00 Технические параметры
Samsung Electronics M386A8K40BM1-CRC00 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Cards | |
| Марка | ||
| PCB changed | 288 | |
| Mounting | Socket | |
| Supplier Package | LRDIMM | |
| CAS Latency | 15 | |
| Number of Chip Banks | 16Chip Banks | |
| Number of Ranks | QuadRank | |
| ECC Support | No | |
| Supplier Temperature Grade | Commercial | |
| Maximum Operating Temperature (°C) | 95 | |
| Minimum Operating Temperature (°C) | 0 | |
| Typical Operating Supply Voltage (V) | 1.2 | |
| Chip Package Type | FBGA |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Chip Configuration | 4Gx4 | |
| Maximum Clock Rate (MHz) | 2400 | |
| Data Bus Width (bit) | 72 | |
| Chip Density (bit) | 16G | |
| Number of Chip per Module | 36Chip per Modules | |
| Module Density | 64Gbyte | |
| Module | DRAM Module | |
| HTS | 8473.30.11.40 | |
| ECCN (US) | 4A994.a | |
| Part Status | LTB | |
| Pin Count | 288 | |
| Organization | 8Gx72 | |
| Module Type | 288RDIMM | |
| RoHS Status | Yes with exemptions |
M386A8K40BM1-CRC00 Документы
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