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M386B4G70DM0-CMA30 Технические параметры

Samsung Electronics  M386B4G70DM0-CMA30 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) 4A994.a
Module DRAM Module
Module Density 32Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1866
Chip Configuration 2Gx4
Chip Package Type 78FBGA
Typical Operating Supply Voltage (V) 1.5
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Свойство продукта Значение свойства
Module Sides Double
ECC Support No
Number of Ranks QuadRank
CAS Latency 13
Supplier Package LRDIMM
Mounting Socket
Package Height 30.35
Package Length 133.35
Package Width 4.8(Max)
PCB changed 240
Part Status Obsolete
Pin Count 240
Organization 4Gx72
Module Type 240LRDIMM

M386B4G70DM0-CMA30 Документы

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