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M391B1G73EB0-YK0 Технические параметры

Samsung Electronics  M391B1G73EB0-YK0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) 4A994.a
HTS 8473.30.51.00
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type 78FBGA
Typical Operating Supply Voltage (V) 1.35
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Свойство продукта Значение свойства
Supplier Temperature Grade Commercial
ECC Support Yes
Number of Ranks DualRank
CAS Latency 11
Supplier Package UDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Part Status Obsolete
Pin Count 240
Organization 1Gx64
Module Type 240UDIMM
RoHS Status RoHS Compliant

M391B1G73EB0-YK0 Документы

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