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M393B1G70BH0-CK0 Технические параметры

Samsung Electronics  M393B1G70BH0-CK0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) 4A994.a
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Max. Access Time (ns) 20
Maximum Clock Rate (MHz) 1600
Chip Configuration 1Gx4
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 2440
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Свойство продукта Значение свойства
Number of Ranks SingleRank
Number of Chip Banks 8Chip Banks
CAS Latency 11
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 1Gx72
PLL No
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant
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M393B1G70BH0-CK0 Документы

M393B1G70BH0-CK0 brand manufacturers: Samsung Electronics, Anli stock, M393B1G70BH0-CK0 reference price.Samsung Electronics. M393B1G70BH0-CK0 parameters, M393B1G70BH0-CK0 Datasheet PDF and pin diagram description download.You can use the M393B1G70BH0-CK0 Memory Cards, DSP Datesheet PDF, find M393B1G70BH0-CK0 pin diagram and circuit diagram and usage method of function,M393B1G70BH0-CK0 electronics tutorials.You can download from the Anli.