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M393B1G70EB0-YK0 Технические параметры

Samsung Electronics  M393B1G70EB0-YK0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1600
Chip Configuration 1Gx4
Minimum Operating Supply Voltage (V) 1.283/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Operating Current (mA) 3960
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
Свойство продукта Значение свойства
ECC Support No
Number of Ranks SingleRank
Number of Chip Banks 8Chip Banks
CAS Latency 11
SPD EEPROM Support Yes
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Part Status Active
Pin Count 240
Organization 1Gx72
PLL No
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant

M393B1G70EB0-YK0 Документы

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