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M393B1G73EB0-YK0 Технические параметры
Samsung Electronics M393B1G73EB0-YK0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Cards | |
| Марка | ||
| Package Height | 30 | |
| Package Length | 133.35 | |
| Package Width | 4(Max) | |
| PCB changed | 240 | |
| Mounting | Socket | |
| Supplier Package | RDIMM | |
| SPD EEPROM Support | Yes | |
| CAS Latency | 11 | |
| Number of Chip Banks | 8Chip Banks | |
| Number of Ranks | DualRank | |
| ECC Support | No | |
| Module Sides | Double | |
| Maximum Operating Temperature (°C) | 95 | |
| Minimum Operating Temperature (°C) | 0 | |
| Operating Current (mA) | 1160 | |
| Maximum Operating Supply Voltage (V) | 1.45/1.575 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Typical Operating Supply Voltage (V) | 1.35/1.5 | |
| Minimum Operating Supply Voltage (V) | 1.283/1.425 | |
| Chip Configuration | 512Mx8 | |
| Maximum Clock Rate (MHz) | 1600 | |
| Data Bus Width (bit) | 72 | |
| Chip Density (bit) | 4G | |
| Number of Chip per Module | 18Chip per Modules | |
| Module Density | 8Gbyte | |
| Module | DRAM Module | |
| HTS | 8473.30.11.40 | |
| ECCN (US) | 4A994.a | |
| Part Status | Active | |
| Pin Count | 240 | |
| Organization | 1Gx72 | |
| PLL | No | |
| Self Refresh | Yes | |
| Module Type | 240RDIMM | |
| RoHS Status | RoHS Compliant |
M393B1G73EB0-YK0 Документы
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