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M393B2G70BH0-CH9 Технические параметры

Samsung Electronics  M393B2G70BH0-CH9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) 4A994.a
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Max. Access Time (ns) 20
Maximum Clock Rate (MHz) 1333
Chip Configuration 1Gx4
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 2480
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Свойство продукта Значение свойства
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant
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M393B2G70BH0-CH9 Документы

M393B2G70BH0-CH9 brand manufacturers: Samsung Electronics, Anli stock, M393B2G70BH0-CH9 reference price.Samsung Electronics. M393B2G70BH0-CH9 parameters, M393B2G70BH0-CH9 Datasheet PDF and pin diagram description download.You can use the M393B2G70BH0-CH9 Memory Cards, DSP Datesheet PDF, find M393B2G70BH0-CH9 pin diagram and circuit diagram and usage method of function,M393B2G70BH0-CH9 electronics tutorials.You can download from the Anli.