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M393B2G70BH0-CK0 Технические параметры
Samsung Electronics M393B2G70BH0-CK0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Cards | |
| Марка | ||
| Surface Mount | NO | |
| Number of Terminals | 240Terminals | |
| ECCN (US) | 4A994.a | |
| Module | DRAM Module | |
| Module Density | 16Gbyte | |
| Number of Chip per Module | 36Chip per Modules | |
| Chip Density (bit) | 4G | |
| Data Bus Width (bit) | 72 | |
| Max. Access Time (ns) | 20 | |
| Maximum Clock Rate (MHz) | 1600 | |
| Chip Configuration | 1Gx4 | |
| Chip Package Type | FBGA | |
| Minimum Operating Supply Voltage (V) | 1.425 | |
| Typical Operating Supply Voltage (V) | 1.5 | |
| Maximum Operating Supply Voltage (V) | 1.575 | |
| Operating Current (mA) | 2800 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 95 | |
| Module Sides | Double | |
| ECC Support | Yes | |
| Number of Ranks | DualRank | |
| Number of Chip Banks | 8Chip Banks | |
| CAS Latency | 11 | |
| SPD EEPROM Support | Yes | |
| Standard Package Name | DIMM | |
| Supplier Package | RDIMM | |
| Mounting | Socket | |
| Package Height | 30 | |
| Package Length | 133.35 | |
| Package Width | 4(Max) | |
| PCB changed | 240 | |
| Lead Shape | No Lead | |
| Package Description | DIMM, DIMM240,40 | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Moisture Sensitivity Levels | 2 | |
| Number of Words Code | 2000000000Words Codes | |
| Package Body Material | UNSPECIFIED | |
| Package Equivalence Code | DIMM240,40 | |
| Reflow Temperature-Max (s) | 40 | |
| Access Time-Max | 0.225 ns | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Manufacturer Part Number | M393B2G70BH0-CK0 | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| Number of Words | 2147483648 wordsWord | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Package Code | DIMM | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Samsung Semiconductor | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Risk Rank | 5.45 | |
| Pbfree Code | Yes | |
| Part Status | Obsolete | |
| Additional Feature | AUTO/SELF REFRESH; WD-MAX | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 240 | |
| JESD-30 Code | R-XDMA-N240 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Power Supplies | 1.5 V | |
| Temperature Grade | OTHER | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Number of Ports | 1Port | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 2Gx72 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 30.15 mm | |
| Memory Width | 72 | |
| Memory Density | 154618822656 bit | |
| PLL | No | |
| I/O Type | COMMON | |
| Memory IC Type | DDR DRAM MODULE | |
| Refresh Cycles | 8192 | |
| Access Mode | DUAL BANK PAGE BURST | |
| Self Refresh | Yes | |
| Module Type | 240RDIMM | |
| Width | 4 mm | |
| Length | 133.35 mm | |
| RoHS Status | Yes with exemptions |
M393B2G70BH0-CK0 Документы
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