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M393B2G70EB0-YK0Q2 Технические параметры

Samsung Electronics  M393B2G70EB0-YK0Q2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) 4A994.a
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1600
Chip Configuration 1Gx4
Minimum Operating Supply Voltage (V) 1.283/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Operating Current (mA) 1890
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support No
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 11
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Свойство продукта Значение свойства
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Maximum Clock Rate 1600(MHz)
Operating Temperature (Max.) 95C
Total Density 16GByte(b)
Operating Temperature Classification Commercial
Package Type RDIMM
Operating Temp Range 0C to 95C
Number of Elements 36 Elements
Device Core Size 72(b)
Operating Supply Voltage (Max) 1.45/1.575(V)
Operating Supply Voltage (Typ) 1.35/1.5(V)
Rad Hardened No
Operating Supply Voltage (Min) 1.283/1.425(V)
Operating Temperature (Min.) 0C
Main Category DRAM Module
Part Status Active
Pin Count 240
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant
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M393B2G70EB0-YK0Q2 Документы

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