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M393B5270CH0-CH9 Технические параметры

Samsung Electronics  M393B5270CH0-CH9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
Mount Socket
Number of Pins 240Pins
ECCN (US) 4A994.a
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 2G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.255
Maximum Clock Rate (MHz) 1333
Chip Configuration 512Mx4
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 2880
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Number of Ranks SingleRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
Свойство продукта Значение свойства
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Number of Elements 18 Elements
RoHS Compliant
Part Status Obsolete
Max Operating Temperature 95 °C
Min Operating Temperature 0 °C
Pin Count 240
Operating Supply Voltage 1.5 V
Max Supply Voltage 1.575 V
Min Supply Voltage 1.425 V
Access Time 255 ps
Organization 512Mx72
Max Frequency 1.333 GHz
PLL No
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant

M393B5270CH0-CH9 Документы

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