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M471B5173DB0-YK0 Технические параметры

Samsung Electronics  M471B5173DB0-YK0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) 4A994.a
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.35
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
Свойство продукта Значение свойства
ECC Support No
Number of Ranks SingleRank
CAS Latency 11
Standard Package Name DIM
Supplier Package USODIMM
Mounting Socket
Package Height 30
Package Length 67.6
Package Width 3.8(Max)
PCB changed 204
Lead Shape No Lead
Part Status Obsolete
Pin Count 204
Organization 512Mx64
Module Type 204USODIMM
RoHS Status RoHS Compliant

M471B5173DB0-YK0 Документы

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