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M474B1G73QH0-YK000 Технические параметры

Samsung Electronics  M474B1G73QH0-YK000 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) EAR99
HTS 8473.30.51.00
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.283/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Operating Current (mA) 1125
Minimum Operating Temperature (°C) 0
Свойство продукта Значение свойства
Maximum Operating Temperature (°C) 95
ECC Support Yes
Number of Ranks DualRank
CAS Latency 11
Standard Package Name DIM
Supplier Package USODIMM
Mounting Socket
Package Height 30
Package Length 67.6
Package Width 3.8(Max)
PCB changed 204
Lead Shape No Lead
Part Status Obsolete
Pin Count 204
Organization 1Gx72
Module Type 204USODIMM
Просмотр сходства

M474B1G73QH0-YK000 Документы

M474B1G73QH0-YK000 brand manufacturers: Samsung Electronics, Anli stock, M474B1G73QH0-YK000 reference price.Samsung Electronics. M474B1G73QH0-YK000 parameters, M474B1G73QH0-YK000 Datasheet PDF and pin diagram description download.You can use the M474B1G73QH0-YK000 Memory Cards, DSP Datesheet PDF, find M474B1G73QH0-YK000 pin diagram and circuit diagram and usage method of function,M474B1G73QH0-YK000 electronics tutorials.You can download from the Anli.