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K4A8G045WB-BCRC Технические параметры
Samsung Semiconductor K4A8G045WB-BCRC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 78Terminals | |
| EU RoHS | Compliant | |
| ECCN (US) | EAR99 | |
| HTS | 8542.32.00.36 | |
| Automotive | No | |
| PPAP | No | |
| DRAM Type | DDR4 SDRAM | |
| Chip Density (bit) | 8G | |
| Number of Internal Banks | 16Internal Banks | |
| Number of Words per Bank | 128M | |
| Number of Bits/Word (bit) | 4Bits/Word (bit)s | |
| Data Bus Width (bit) | 4 | |
| Maximum Clock Rate (MHz) | 2400 | |
| Maximum Access Time (ns) | 0.175 | |
| Address Bus Width (bit) | 19 | |
| Interface Type | POD | |
| Minimum Operating Supply Voltage (V) | 1.14 | |
| Typical Operating Supply Voltage (V) | 1.2 | |
| Maximum Operating Supply Voltage (V) | 1.26 | |
| Operating Current (mA) | 93 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 95 | |
| Supplier Temperature Grade | Commercial | |
| Number of I/O Lines (bit) | 4I/O Lines (bit)s | |
| Mounting | Surface Mount | |
| Package Height | 0.73 | |
| Package Width | 7.5 | |
| Package Length | 11 | |
| PCB changed | 78 | |
| Standard Package Name | BGA | |
| Supplier Package | FBGA | |
| Lead Shape | Ball | |
| Package Description | FBGA, BGA78,9X13,32 | |
| Package Style | GRID ARRAY, FINE PITCH |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA78,9X13,32 | |
| Access Time-Max | 0.175 ns | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | K4A8G045WB-BCRC | |
| Clock Frequency-Max (fCLK) | 1200 MHz | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Package Code | FBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Samsung Semiconductor | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Risk Rank | 5.8 | |
| Part Status | Active | |
| Subcategory | DRAMs | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 78 | |
| JESD-30 Code | R-PBGA-B78 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 1.2 V | |
| Temperature Grade | OTHER | |
| Supply Current-Max | 0.2359 mA | |
| Organization | 2Gx4 | |
| Output Characteristics | 3-STATE | |
| Standby Current-Max | 0.015 A | |
| Memory Density | 8589934592 bit | |
| I/O Type | COMMON | |
| Memory IC Type | DDR DRAM | |
| Refresh Cycles | 8192 | |
| Sequential Burst Length | 4,8 | |
| Interleaved Burst Length | 4,8 |
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