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K4B2G0446C-HCF8 Технические параметры

Samsung Semiconductor  K4B2G0446C-HCF8 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 78Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA78,9X13,32
Clock Frequency-Max (fCLK) 533 MHz
Supply Voltage-Nom (Vsup) 1.5 V
Package Style GRID ARRAY, FINE PITCH
Package Shape RECTANGULAR
Package Equivalence Code BGA78,9X13,32
Package Code FBGA
Package Body Material PLASTIC/EPOXY
Operating Temperature-Max 85 °C
Number of Words Code 512000000Words Codes
Number of Words 536870912 wordsWord
Moisture Sensitivity Levels 3
JESD-609 Code e1
ECCN Code EAR99
Свойство продукта Значение свойства
Terminal Finish TIN SILVER COPPER
HTS Code 8542.32.00.36
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B78
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.16 mA
Organization 512MX4
Output Characteristics 3-STATE
Memory Width 4
Standby Current-Max 0.012 A
Memory Density 2147483648 bit
I/O Type COMMON
Memory IC Type DDR3 DRAM
Refresh Cycles 8192
Sequential Burst Length 8
Interleaved Burst Length 8
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K4B2G0446C-HCF8 Документы

  • Datasheets
K4B2G0446C-HCF8 brand manufacturers: Samsung Semiconductor, Anli stock, K4B2G0446C-HCF8 reference price.Samsung Semiconductor. K4B2G0446C-HCF8 parameters, K4B2G0446C-HCF8 Datasheet PDF and pin diagram description download.You can use the K4B2G0446C-HCF8 Memory, DSP Datesheet PDF, find K4B2G0446C-HCF8 pin diagram and circuit diagram and usage method of function,K4B2G0446C-HCF8 electronics tutorials.You can download from the Anli.