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K4B2G0846C-HCF7 Технические параметры

Samsung Semiconductor  K4B2G0846C-HCF7 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 78Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA78,9X13,32
Clock Frequency-Max (fCLK) 400 MHz
Moisture Sensitivity Levels 3
Number of Words 268435456 wordsWord
Number of Words Code 256000000Words Codes
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA78,9X13,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 1.5 V
JESD-609 Code e1
Свойство продукта Значение свойства
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
HTS Code 8542.32.00.36
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B78
Qualification Status Not Qualified
Temperature Grade OTHER
Organization 256MX8
Output Characteristics 3-STATE
Memory Width 8
Memory Density 2147483648 bit
I/O Type COMMON
Memory IC Type DDR3 DRAM
Refresh Cycles 8192
Sequential Burst Length 8
Interleaved Burst Length 8
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K4B2G0846C-HCF7 Документы

  • Datasheets
K4B2G0846C-HCF7 brand manufacturers: Samsung Semiconductor, Anli stock, K4B2G0846C-HCF7 reference price.Samsung Semiconductor. K4B2G0846C-HCF7 parameters, K4B2G0846C-HCF7 Datasheet PDF and pin diagram description download.You can use the K4B2G0846C-HCF7 Memory, DSP Datesheet PDF, find K4B2G0846C-HCF7 pin diagram and circuit diagram and usage method of function,K4B2G0846C-HCF7 electronics tutorials.You can download from the Anli.