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K4B2G1646B-HCF7000 Технические параметры

Samsung Semiconductor  K4B2G1646B-HCF7000 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
EU RoHS Compliant
ECCN (US) EAR99
Automotive No
PPAP No
DRAM Type DDR3 SDRAM
Chip Density (bit) 2G
Number of Internal Banks 8Internal Banks
Number of Words per Bank 16M
Number of Bits/Word (bit) 16Bits/Word (bit)s
Data Bus Width (bit) 16
Maximum Clock Rate (MHz) 800
Maximum Access Time (ns) 20
Address Bus Width (bit) 17
Interface Type SSTL_1.5
Lead Shape Ball
Свойство продукта Значение свойства
Supplier Package FBGA
Standard Package Name BGA
PCB changed 96
Package Length 13.3
Package Width 9
Package Height 0.75
Mounting Surface Mount
Number of I/O Lines (bit) 16I/O Lines (bit)s
Maximum Operating Temperature (°C) 95
Minimum Operating Temperature (°C) 0
Operating Current (mA) 155
Maximum Operating Supply Voltage (V) 1.575
Typical Operating Supply Voltage (V) 1.5
Minimum Operating Supply Voltage (V) 1.425
Part Status Obsolete
Pin Count 96
Organization 128Mx16
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