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K4D553238E-JC36 Технические параметры

Samsung Semiconductor  K4D553238E-JC36 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 144Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description LFBGA, BGA144,12X12,32
Access Time-Max 0.6 ns
Clock Frequency-Max (fCLK) 275 MHz
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 65 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA144,12X12,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 2.5 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.24
Terminal Position BOTTOM
Свойство продукта Значение свойства
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Pin Count 144
JESD-30 Code S-PBGA-B144
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.375 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Organization 8MX32
Output Characteristics 3-STATE
Seated Height-Max 1.4 mm
Memory Width 32
Memory Density 268435456 bit
I/O Type COMMON
Memory IC Type GDDR1 DRAM
Refresh Cycles 4096
Sequential Burst Length 2,4,8
Interleaved Burst Length 2,4,8
Access Mode FOUR BANK PAGE BURST
Self Refresh YES
Length 12 mm
Width 12 mm
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K4D553238E-JC36 Документы

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