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K4M281633H-BL75 Технические параметры

Samsung Semiconductor  K4M281633H-BL75 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 54Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA54,9X9,32
Access Time-Max 5.4 ns
Clock Frequency-Max (fCLK) 133 MHz
Moisture Sensitivity Levels 1
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 70 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA54,9X9,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
JESD-609 Code e3
Pbfree Code Yes
Свойство продукта Значение свойства
ECCN Code EAR99
Terminal Finish MATTE TIN
HTS Code 8542.32.00.02
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B54
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.07 mA
Organization 8MX16
Output Characteristics 3-STATE
Memory Width 16
Standby Current-Max 0.0005 A
Memory Density 134217728 bit
I/O Type COMMON
Memory IC Type SYNCHRONOUS DRAM
Refresh Cycles 4096
Sequential Burst Length 1,2,4,8,FP
Interleaved Burst Length 1,2,4,8
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K4M281633H-BL75 Документы

  • Datasheets
K4M281633H-BL75 brand manufacturers: Samsung Semiconductor, Anli stock, K4M281633H-BL75 reference price.Samsung Semiconductor. K4M281633H-BL75 parameters, K4M281633H-BL75 Datasheet PDF and pin diagram description download.You can use the K4M281633H-BL75 Memory, DSP Datesheet PDF, find K4M281633H-BL75 pin diagram and circuit diagram and usage method of function,K4M281633H-BL75 electronics tutorials.You can download from the Anli.