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K4M51163LC-BG1H Технические параметры

Samsung Semiconductor  K4M51163LC-BG1H technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 54Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA54,9X9,32
Access Time-Max 7 ns
Clock Frequency-Max (fCLK) 111 MHz
Number of Words 33554432 wordsWord
Number of Words Code 32000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA54,9X9,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 2.5 V
Свойство продукта Значение свойства
ECCN Code EAR99
HTS Code 8542.32.00.28
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B54
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.18 mA
Organization 32MX16
Output Characteristics 3-STATE
Memory Width 16
Standby Current-Max 0.001 A
Memory Density 536870912 bit
I/O Type COMMON
Memory IC Type SYNCHRONOUS DRAM
Refresh Cycles 8192
Sequential Burst Length 1,2,4,8,FP
Interleaved Burst Length 1,2,4,8
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K4M51163LC-BG1H Документы

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