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K4M56163PG-BF75 Технические параметры

Samsung Semiconductor  K4M56163PG-BF75 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 54Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA54,9X9,32
Access Time-Max 6 ns
Clock Frequency-Max (fCLK) 133 MHz
Moisture Sensitivity Levels 1
Number of Words 16777216 wordsWord
Number of Words Code 16000000Words Codes
Operating Temperature-Max 70 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA54,9X9,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
JESD-609 Code e3
Свойство продукта Значение свойства
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish MATTE TIN
HTS Code 8542.32.00.24
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B54
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.075 mA
Organization 16MX16
Output Characteristics 3-STATE
Memory Width 16
Standby Current-Max 0.00001 A
Memory Density 268435456 bit
I/O Type COMMON
Memory IC Type SYNCHRONOUS DRAM
Refresh Cycles 8192
Sequential Burst Length 1,2,4,8,FP
Interleaved Burst Length 1,2,4,8
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K4M56163PG-BF75 Документы

K4M56163PG-BF75 brand manufacturers: Samsung Semiconductor, Anli stock, K4M56163PG-BF75 reference price.Samsung Semiconductor. K4M56163PG-BF75 parameters, K4M56163PG-BF75 Datasheet PDF and pin diagram description download.You can use the K4M56163PG-BF75 Memory, DSP Datesheet PDF, find K4M56163PG-BF75 pin diagram and circuit diagram and usage method of function,K4M56163PG-BF75 electronics tutorials.You can download from the Anli.