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K4M563233G-HG60 Технические параметры

Samsung Semiconductor  K4M563233G-HG60 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 90Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description FBGA, BGA90,9X15,32
Access Time-Max 5.4 ns
Clock Frequency-Max (fCLK) 166 MHz
Moisture Sensitivity Levels 1
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA90,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
JESD-609 Code e3
Свойство продукта Значение свойства
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish MATTE TIN
HTS Code 8542.32.00.24
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B90
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.18 mA
Organization 8MX32
Memory Width 32
Standby Current-Max 0.001 A
Memory Density 268435456 bit
I/O Type COMMON
Memory IC Type SYNCHRONOUS DRAM
Refresh Cycles 4096
Sequential Burst Length 1,2,4,8,FP
Interleaved Burst Length 1,2,4,8
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K4M563233G-HG60 Документы

  • Datasheets
K4M563233G-HG60 brand manufacturers: Samsung Semiconductor, Anli stock, K4M563233G-HG60 reference price.Samsung Semiconductor. K4M563233G-HG60 parameters, K4M563233G-HG60 Datasheet PDF and pin diagram description download.You can use the K4M563233G-HG60 Memory, DSP Datesheet PDF, find K4M563233G-HG60 pin diagram and circuit diagram and usage method of function,K4M563233G-HG60 electronics tutorials.You can download from the Anli.