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Samsung Semiconductor K4S280832O-LC60 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 54Terminals | |
| EU RoHS | Compliant | |
| ECCN (US) | EAR99 | |
| Automotive | No | |
| PPAP | No | |
| DRAM Type | SDRAM | |
| Chip Density (bit) | 128M | |
| Number of Internal Banks | 4Internal Banks | |
| Number of Words per Bank | 4M | |
| Number of Bits/Word (bit) | 8Bits/Word (bit)s | |
| Data Bus Width (bit) | 8 | |
| Maximum Clock Rate (MHz) | 333 | |
| Maximum Access Time (ns) | 5 | |
| Address Bus Width (bit) | 13 | |
| Interface Type | LVTTL | |
| Minimum Operating Supply Voltage (V) | 3 | |
| Typical Operating Supply Voltage (V) | 3.3 | |
| Maximum Operating Supply Voltage (V) | 3.6 | |
| Operating Current (mA) | 60 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 70 | |
| Number of I/O Lines (bit) | 8I/O Lines (bit)s | |
| Mounting | Surface Mount | |
| Package Height | 1 | |
| Package Width | 10.16 | |
| Package Length | 22.62(Max) | |
| PCB changed | 54 | |
| Standard Package Name | SOP | |
| Supplier Package | TSOP-II | |
| Lead Shape | Gull-wing | |
| Package Description | TSOP, TSOP54,.46,32 | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Number of Words Code | 16000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Package Equivalence Code | TSOP54,.46,32 | |
| Access Time-Max | 5 ns | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | K4S280832O-LC60 | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| Number of Words | 16777216 wordsWord | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Package Code | TSOP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Samsung Semiconductor | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Risk Rank | 5.84 | |
| Part Status | Obsolete | |
| Subcategory | DRAMs | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 54 | |
| JESD-30 Code | R-PDSO-G54 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3.3 V | |
| Temperature Grade | OTHER | |
| Supply Current-Max | 0.06 mA | |
| Organization | 16Mx8 | |
| Output Characteristics | 3-STATE | |
| Memory Width | 8 | |
| Standby Current-Max | 0.002 A | |
| Memory Density | 134217728 bit | |
| I/O Type | COMMON | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Refresh Cycles | 4096 | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Interleaved Burst Length | 1,2,4,8 |