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K4S563233F-HN60 Технические параметры

Samsung Semiconductor  K4S563233F-HN60 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 90Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Access Time-Max 5.4 ns
Clock Frequency-Max (fCLK) 166 MHz
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA90,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
ECCN Code EAR99
Свойство продукта Значение свойства
HTS Code 8542.32.00.24
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B90
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.2 mA
Organization 8MX32
Memory Width 32
Standby Current-Max 0.0005 A
Memory Density 268435456 bit
I/O Type COMMON
Memory IC Type SYNCHRONOUS DRAM
Refresh Cycles 4096
Sequential Burst Length 1,2,4,8,FP
Interleaved Burst Length 1,2,4,8
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K4S563233F-HN60 Документы

  • Datasheets
K4S563233F-HN60 brand manufacturers: Samsung Semiconductor, Anli stock, K4S563233F-HN60 reference price.Samsung Semiconductor. K4S563233F-HN60 parameters, K4S563233F-HN60 Datasheet PDF and pin diagram description download.You can use the K4S563233F-HN60 Memory, DSP Datesheet PDF, find K4S563233F-HN60 pin diagram and circuit diagram and usage method of function,K4S563233F-HN60 electronics tutorials.You can download from the Anli.