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K4S643232F-TC50000 Технические параметры
Samsung Semiconductor K4S643232F-TC50000 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| EU RoHS | Not Compliant | |
| ECCN (US) | EAR99 | |
| Automotive | No | |
| PPAP | No | |
| DRAM Type | SDRAM | |
| Chip Density (bit) | 64M | |
| Number of Internal Banks | 4Internal Banks | |
| Number of Words per Bank | 512K | |
| Number of Bits/Word (bit) | 32Bits/Word (bit)s | |
| Data Bus Width (bit) | 32 | |
| Maximum Clock Rate (MHz) | 200 | |
| Maximum Access Time (ns) | 4.5|6 | |
| Address Bus Width (bit) | 13 | |
| Interface Type | LVTTL | |
| Minimum Operating Supply Voltage (V) | 3 | |
| Typical Operating Supply Voltage (V) | 3.3 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Maximum Operating Supply Voltage (V) | 3.6 | |
| Operating Current (mA) | 170 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 70 | |
| Supplier Temperature Grade | Commercial | |
| Number of I/O Lines (bit) | 32I/O Lines (bit)s | |
| Mounting | Surface Mount | |
| Package Height | 1 | |
| Package Width | 10.16 | |
| Package Length | 22.62(Max) | |
| PCB changed | 86 | |
| Standard Package Name | SOP | |
| Supplier Package | TSOP-II | |
| Lead Shape | Gull-wing | |
| Packaging | Tape and Reel | |
| Part Status | Obsolete | |
| Pin Count | 86 | |
| Organization | 2Mx32 |
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