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K6F4008U2C-FF70 Технические параметры

Samsung Semiconductor  K6F4008U2C-FF70 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 48Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description TFBGA, BGA36,6X8,30
Access Time-Max 70 ns
Number of Words 524288 wordsWord
Number of Words Code 512000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA36,6X8,30
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 3 V
JESD-609 Code e0
ECCN Code 3A991.B.2.A
Terminal Finish TIN LEAD
HTS Code 8542.32.00.41
Terminal Position BOTTOM
Свойство продукта Значение свойства
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.75 mm
Reach Compliance Code unknown
Pin Count 48
JESD-30 Code R-PBGA-B48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.3 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.03 mA
Organization 512KX8
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 8
Standby Current-Max 0.000003 A
Memory Density 4194304 bit
Parallel/Serial PARALLEL
I/O Type COMMON
Memory IC Type STANDARD SRAM
Standby Voltage-Min 1.5 V
Length 8.5 mm
Width 6.5 mm
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K6F4008U2C-FF70 Документы

  • Datasheets
K6F4008U2C-FF70 brand manufacturers: Samsung Semiconductor, Anli stock, K6F4008U2C-FF70 reference price.Samsung Semiconductor. K6F4008U2C-FF70 parameters, K6F4008U2C-FF70 Datasheet PDF and pin diagram description download.You can use the K6F4008U2C-FF70 Memory, DSP Datesheet PDF, find K6F4008U2C-FF70 pin diagram and circuit diagram and usage method of function,K6F4008U2C-FF70 electronics tutorials.You can download from the Anli.