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K6T0808V1D-RF70 Технические параметры

Samsung Semiconductor  K6T0808V1D-RF70 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 28Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP
Package Description TSOP1-R, TSSOP28,.53,22
Access Time-Max 70 ns
Number of Words 32768 wordsWord
Number of Words Code 32000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSOP1-R
Package Equivalence Code TSSOP28,.53,22
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Supply Voltage-Nom (Vsup) 3.3 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish TIN LEAD
HTS Code 8542.32.00.41
Terminal Position DUAL
Свойство продукта Значение свойства
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 0.55 mm
Reach Compliance Code compliant
Pin Count 28
JESD-30 Code R-PDSO-G28
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.035 mA
Organization 32KX8
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 8
Memory Density 262144 bit
Parallel/Serial PARALLEL
I/O Type COMMON
Memory IC Type STANDARD SRAM
Standby Voltage-Min 2 V
Reverse Pinout YES
Length 11.8 mm
Width 8 mm
Просмотр сходства
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