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- K6X8016T3B-TF70000
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K6X8016T3B-TF70000 Технические параметры
Samsung Semiconductor K6X8016T3B-TF70000 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Mount | Surface Mount | |
| Surface Mount | YES | |
| Number of Pins | 44Pins | |
| Number of Terminals | 44Terminals | |
| EU RoHS | Not Compliant | |
| ECCN (US) | 3A991.b.2.a | |
| Automotive | No | |
| PPAP | No | |
| Chip Density (bit) | 8M | |
| Number of Words | 512KWord | |
| Number of Bits/Word (bit) | 16Bits/Word (bit)s | |
| Data Rate Architecture | SDR | |
| Address Bus Width (bit) | 19 | |
| Timing Type | Asynchronous | |
| Max. Access Time (ns) | 70 | |
| Minimum Operating Supply Voltage (V) | 2.7 | |
| Typical Operating Supply Voltage (V) | 3|3.3 | |
| Maximum Operating Supply Voltage (V) | 3.6 | |
| Operating Current (mA) | 30 | |
| Minimum Operating Temperature (°C) | -40 | |
| Maximum Operating Temperature (°C) | 85 | |
| Supplier Temperature Grade | Industrial | |
| Mounting | Surface Mount | |
| Package Height | 1 | |
| Package Width | 10.16 | |
| Package Length | 18.81(Max) | |
| PCB changed | 44 | |
| Standard Package Name | SOP | |
| Supplier Package | TSOP-II | |
| Lead Shape | Gull-wing | |
| RoHS | Non-Compliant | |
| Package Description | TSOP, TSOP44,.46,32 | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Moisture Sensitivity Levels | 1 | |
| Number of Words Code | 512000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | TSOP44,.46,32 | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Access Time-Max | 70 ns | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | No |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Manufacturer Part Number | K6X8016T3B-TF70000 | |
| Package Code | TSOP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Samsung Semiconductor | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Risk Rank | 5.92 | |
| Packaging | Tray | |
| Pbfree Code | No | |
| Part Status | Obsolete | |
| Max Operating Temperature | 85 °C | |
| Min Operating Temperature | -40 °C | |
| Subcategory | SRAMs | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 225 | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 44 | |
| JESD-30 Code | R-PDSO-G44 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3/3.3 V | |
| Temperature Grade | INDUSTRIAL | |
| Max Supply Voltage | 3.6 V | |
| Min Supply Voltage | 2.7 V | |
| Number of Ports | 1Port | |
| Nominal Supply Current | 30 mA | |
| Operating Mode | ASYNCHRONOUS | |
| Supply Current-Max | 0.045 mA | |
| Access Time | 70 ns | |
| Organization | 512KX16 | |
| Output Characteristics | 3-STATE | |
| Memory Width | 16 | |
| Address Bus Width | 19 b | |
| Density | 8 Mb | |
| Standby Current-Max | 0.000015 A | |
| Memory Density | 8388608 bit | |
| Parallel/Serial | PARALLEL | |
| I/O Type | COMMON | |
| Sync/Async | Asynchronous | |
| Word Size | 16 b | |
| Memory IC Type | STANDARD SRAM | |
| Standby Voltage-Min | 1.5 V |
Индекс :
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