Локаль
Язык
- English
- русский
Валюта
- CNY-¥
- RUB-₽
Цена такой валюты может меняться в зависимости от курса только для справки
Корзина для покупок - Все продукты
- /
- Integrated Circuits (ICs)
- /
- Memory
- /
- K7R321882M-FC16000
Есть складские запасы
Min. : 1
Mult. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
K7R321882M-FC16000 Технические параметры
Samsung Semiconductor K7R321882M-FC16000 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 165Terminals | |
| EU RoHS | Not Compliant | |
| Automotive | No | |
| PPAP | No | |
| Mounting | Surface Mount | |
| Package Height | 0.95 | |
| Package Width | 15 | |
| Package Length | 17 | |
| PCB changed | 165 | |
| Standard Package Name | BGA | |
| Supplier Package | FBGA | |
| Lead Shape | Ball | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Moisture Sensitivity Levels | 3 | |
| Number of Words Code | 2000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Reflow Temperature-Max (s) | 40 | |
| Access Time-Max | 0.5 ns | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | K7R321882M-FC16000 | |
| Clock Frequency-Max (fCLK) | 166.66 MHz | |
| Number of Words | 2097152 wordsWord | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Samsung Semiconductor | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Risk Rank | 5.92 | |
| JESD-609 Code | e1 | |
| Pbfree Code | No | |
| Part Status | Obsolete | |
| Terminal Finish | TIN SILVER COPPER | |
| Subcategory | SRAMs | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 165 | |
| JESD-30 Code | R-PBGA-B165 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Power Supplies | 1.5/1.8,1.8 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 0.65 mA | |
| Organization | 2MX18 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 1.4 mm | |
| Memory Width | 18 | |
| Standby Current-Max | 0.27 A | |
| Memory Density | 37748736 bit | |
| Parallel/Serial | PARALLEL | |
| I/O Type | SEPARATE | |
| Memory IC Type | QDR SRAM | |
| Standby Voltage-Min | 1.7 V | |
| Width | 15 mm | |
| Length | 17 mm |
Индекс :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ