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KLMCG4JETD-B0410 Технические параметры
Samsung Semiconductor KLMCG4JETD-B0410 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | USB Flash Drives | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 153Terminals | |
| EU RoHS | Compliant | |
| ECCN (US) | 3A991.b.1.a | |
| HTS | 8542.32.00.71 | |
| Automotive | No | |
| PPAP | No | |
| Cell Type | NAND | |
| Chip Density (bit) | 512G | |
| Number of Bits/Word (bit) | 1/4/8 | |
| Number of Words | 512G/128G/64GWord | |
| Programmability | Yes | |
| Timing Type | Synchronous | |
| Maximum Erase Time (S) | 0.02 | |
| Interface Type | Serial e-MMC | |
| Minimum Operating Supply Voltage (V) | 1.7|2.7 | |
| Maximum Operating Frequency (MHz) | 200 | |
| Typical Operating Supply Voltage (V) | 1.8|3.3 | |
| Maximum Operating Supply Voltage (V) | 1.95|3.6 | |
| Minimum Operating Temperature (°C) | -25 | |
| Maximum Operating Temperature (°C) | 85 | |
| Command Compatible | Yes | |
| ECC Support | Yes | |
| Support of Page Mode | No | |
| Mounting | Surface Mount | |
| Package Height | 0.71 | |
| Package Width | 11.5 | |
| Package Length | 13 | |
| PCB changed | 153 | |
| Standard Package Name | BGA | |
| Supplier Package | FBGA | |
| Lead Shape | Ball | |
| Package Description | VFBGA, | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Number of Words Code | 64000000000Words Codes |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -25 °C | |
| Operating Temperature-Max | 85 °C | |
| Manufacturer Part Number | KLMCG4JETD-B0410 | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Samsung Semiconductor | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Risk Rank | 5.79 | |
| Part Status | Active | |
| Type | MLC NAND TYPE | |
| Additional Feature | ALSO OPERATES @ 3V SUP NOM | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 153 | |
| JESD-30 Code | R-PBGA-B153 | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Temperature Grade | OTHER | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 64GX8 | |
| Seated Height-Max | 1 mm | |
| Memory Width | 8 | |
| Memory Density | 549755813888 bit | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 1.8 V | |
| Boot Block | Yes | |
| Width | 11.5 mm | |
| Length | 13 mm |
Индекс :
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