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- M378B5773CH0-CH900
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M378B5773CH0-CH900 Технические параметры
Samsung Semiconductor M378B5773CH0-CH900 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory - Modules | |
| Марка | ||
| EU RoHS | Compliant | |
| ECCN (US) | 4A994.a | |
| Automotive | No | |
| PPAP | No | |
| Module | DRAM Module | |
| Module Density | 2Gbyte | |
| Number of Chip per Module | 8Chip per Modules | |
| Chip Density (bit) | 2G | |
| Data Bus Width (bit) | 64 | |
| Max. Access Time (ns) | 0.255 | |
| Maximum Clock Rate (MHz) | 1333 | |
| Chip Configuration | 256Mx8 | |
| Chip Package Type | FBGA | |
| Minimum Operating Supply Voltage (V) | 1.425 | |
| Typical Operating Supply Voltage (V) | 1.5 | |
| Maximum Operating Supply Voltage (V) | 1.575 | |
| Operating Current (mA) | 1120 | |
| Minimum Operating Temperature (°C) | 0 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Maximum Operating Temperature (°C) | 95 | |
| Module Sides | Single | |
| ECC Support | No | |
| Number of Ranks | SingleRank | |
| Number of Chip Banks | 8Chip Banks | |
| CAS Latency | 9 | |
| SPD EEPROM Support | Yes | |
| Mounting | Socket | |
| Package Height | 30 | |
| Package Width | 4(Max) | |
| Package Length | 133.35 | |
| PCB changed | 240 | |
| Supplier Package | UDIMM | |
| Lead Shape | No Lead | |
| Part Status | Obsolete | |
| Pin Count | 240 | |
| Organization | 256Mx64 | |
| PLL | No | |
| Self Refresh | Yes | |
| Module Type | 240UDIMM |
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