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M386B4G70DM0-YH9 Технические параметры

Samsung Semiconductor  M386B4G70DM0-YH9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory - Modules
Марка
EU RoHS Supplier Unconfirmed
ECCN (US) 4A994.a
Automotive No
PPAP No
Module DRAM Module
Module Density 32Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1333
Chip Configuration 2Gx4
Свойство продукта Значение свойства
Chip Package Type 78FBGA
Typical Operating Supply Voltage (V) 1.35
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support No
Number of Ranks QuadRank
CAS Latency 9
Part Status Obsolete
Organization 4Gx72
Module Type 240LRDIMM
M386B4G70DM0-YH9 brand manufacturers: Samsung Semiconductor, Anli stock, M386B4G70DM0-YH9 reference price.Samsung Semiconductor. M386B4G70DM0-YH9 parameters, M386B4G70DM0-YH9 Datasheet PDF and pin diagram description download.You can use the M386B4G70DM0-YH9 Memory - Modules, DSP Datesheet PDF, find M386B4G70DM0-YH9 pin diagram and circuit diagram and usage method of function,M386B4G70DM0-YH9 electronics tutorials.You can download from the Anli.