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M393A1G40DB0-CPB Технические параметры
Samsung Semiconductor M393A1G40DB0-CPB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory - Modules | |
| Марка | ||
| Surface Mount | NO | |
| Number of Terminals | 288Terminals | |
| EU RoHS | Compliant | |
| HTS | 8473.30.11.40 | |
| Automotive | No | |
| PPAP | No | |
| Module | DRAM Module | |
| Module Density | 8Gbyte | |
| Number of Chip per Module | 18Chip per Modules | |
| Chip Density (bit) | 4G | |
| Data Bus Width (bit) | 72 | |
| Max. Access Time (ns) | 0.18 | |
| Maximum Clock Rate (MHz) | 2133 | |
| Chip Configuration | 1Gx4 | |
| Chip Package Type | 78FBGA | |
| Minimum Operating Supply Voltage (V) | 1.14 | |
| Typical Operating Supply Voltage (V) | 1.2 | |
| Maximum Operating Supply Voltage (V) | 1.26 | |
| Operating Current (mA) | 2240 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 85 | |
| Supplier Temperature Grade | Commercial | |
| Module Sides | Double | |
| ECC Support | Yes | |
| Number of Ranks | SingleRank | |
| Number of Chip Banks | 16Chip Banks | |
| CAS Latency | 15 | |
| SPD EEPROM Support | No | |
| Mounting | Socket | |
| Package Height | 31.25 | |
| Package Width | 4.3(Max) | |
| Package Length | 133.35 | |
| PCB changed | 288 | |
| Supplier Package | RDIMM | |
| Risk Rank | 5.38 | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Life Cycle Code | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Manufacturer | Samsung Semiconductor | |
| Package Shape | RECTANGULAR | |
| Package Code | DIMM | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Number of Words | 1073741824 wordsWord | |
| Manufacturer Part Number | M393A1G40DB0-CPB | |
| Rohs Code | Yes | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Package Body Material | UNSPECIFIED | |
| Number of Words Code | 1000000000Words Codes | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Package Description | DIMM, | |
| Part Status | Obsolete | |
| ECCN Code | EAR99 | |
| Additional Feature | AUTO/SELF REFRESH; WD-MAX | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.85 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 288 | |
| JESD-30 Code | R-XDMA-N288 | |
| Supply Voltage-Max (Vsup) | 1.26 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Number of Ports | 1Port | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 1Gx72 | |
| Seated Height-Max | 31.4 mm | |
| Memory Width | 72 | |
| Memory Density | 77309411328 bit | |
| PLL | No | |
| Memory IC Type | DDR DRAM MODULE | |
| Access Mode | SINGLE BANK PAGE BURST | |
| Self Refresh | Yes | |
| Module Type | 288RDIMM | |
| Length | 133.35 mm | |
| Width | 3.9 mm |
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