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- M395T2863QZ4-CE66
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M395T2863QZ4-CE66 Технические параметры
Samsung Semiconductor M395T2863QZ4-CE66 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory - Modules | |
| Марка | ||
| Automotive | No | |
| PPAP | No | |
| Module | DRAM Module | |
| Module Density | 1Gbyte | |
| Number of Chip per Module | 9Chip per Modules | |
| Chip Density (bit) | 1G | |
| Data Bus Width (bit) | 72 | |
| Maximum Clock Rate (MHz) | 667 | |
| Chip Configuration | 128Mx8 | |
| Chip Package Type | FBGA | |
| Minimum Operating Supply Voltage (V) | 1.7 | |
| Typical Operating Supply Voltage (V) | 1.8 | |
| Maximum Operating Supply Voltage (V) | 1.9 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 85 | |
| Module Sides | Double | |
| ECC Support | Yes | |
| Number of Ranks | SingleRank |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Chip Banks | 8Chip Banks | |
| CAS Latency | 5 | |
| PC Type | PC2-5300 | |
| SPD EEPROM Support | Yes | |
| Mounting | Socket | |
| Package Height | 30.35 | |
| Package Width | 8.2(Max) | |
| Package Length | 133.35 | |
| PCB changed | 240 | |
| Supplier Package | FBDIMM | |
| ECCN (US) | EAR99 | |
| EU RoHS | Compliant | |
| Lead Shape | No Lead | |
| Part Status | Obsolete | |
| Pin Count | 240 | |
| Organization | 128Mx72 | |
| PLL | Yes | |
| Self Refresh | Yes | |
| Module Type | 240FBDIMM |
Индекс :
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