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HDAF-11-18.0-S-13-2 Технические параметры

Samtec Inc.  HDAF-11-18.0-S-13-2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Марка
Factory Lead Time 5 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Housing Material Polymer
Contact Materials Copper
Packaging Tray
Series HD Mezz™ HDAF
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type High Density Array, Female
Number of Positions 143Positions
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Color Black
Number of Rows 13Rows
Gender Receptacle
Additional Feature FINAL INCH, HD MEZZ
HTS Code 8536.69.40.40
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.047 1.20mm
Total Number of Contacts 143Contacts
Свойство продукта Значение свойства
Orientation Straight
Depth 22.5mm
Current Rating 2.3A
Number of Conductors ONEConductor
Reference Standard UL
Contact Finish Gold
Voltage - Rated AC 200V
Reliability COMMERCIAL
Number Of PCB Rows 13
Lead Pitch 1.2mm
PCB Contact Pattern RECTANGULAR
Mating Information MULTIPLE MATING PARTS AVAILABLE
Body Breadth 0.886 inch
Rated Current (Signal) 1.8A
Contact Resistance 19mOhm
Insulation Resistance 5000000000Ohm
Row Spacing 2 mm
Max Voltage Rating (AC) 200V
Max Current Rating 2.3A
Dielectric Withstanding Voltage 700VAC V
Durability 100 Cycles
Contact Pattern RECTANGULAR
Features Board Guide
Length 39.92mm
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 30μin
Height Above Board 0.807 20.51mm
Stack Height (Mating) 30mm 35mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
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