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- HSEC8-108-01-L-DP-A-K
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HSEC8-108-01-L-DP-A-K Технические параметры
Samtec, Inc. HSEC8-108-01-L-DP-A-K technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Adapters | |
| Марка | ||
| Contact Plating | Gold | |
| Mounting Type | Surface Mount | |
| Housing Material | Liquid Crystal Polymer (LCP) | |
| Material - Insulation | Liquid Crystal Polymer (LCP) | |
| RoHS | Details | |
| Mounting Styles | Mounting Peg | |
| Contact Materials | Beryllium Copper | |
| Maximum Operating Temperature | + 125 C | |
| Minimum Operating Temperature | - 55 C | |
| Factory Pack QuantityFactory Pack Quantity | 250 | |
| Tradename | Edge Rate | |
| Package | Tape & Reel (TR);Cut Tape (CT); | |
| Base Product Number | HSEC8-108 | |
| Mfr | Samtec Inc. | |
| Product Status | Active | |
| Series | HSEC8 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Operating Temperature | -55°C ~ 125°C | |
| Termination | Solder | |
| Number of Positions | 16 PositionPosition | |
| Color | Black | |
| Number of Rows | 2 RowRow | |
| Gender | Female | |
| Contact Type | Cantilever | |
| Pitch | 0.8 mm | |
| Contact Finish | Gold | |
| Card Type | PCI Express™ | |
| Read Out | Dual | |
| Number of Positions/Bay/Row | - | |
| Flange Feature | - | |
| Product | Sockets | |
| Features | Board Guide, Pick and Place | |
| Contact Finish Thickness | 10.0µin (0.25µm) | |
| Card Thickness | 0.063 (1.60mm) |
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