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H5MS1G62MFP-L3M Технические параметры

SK Hynix Inc  H5MS1G62MFP-L3M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 60Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description VFBGA, BGA60,9X10,32
Access Time-Max 7 ns
Clock Frequency-Max (fCLK) 100 MHz
Number of Words 67108864 wordsWord
Number of Words Code 64000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA60,9X10,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
JESD-609 Code e1
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.32
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Свойство продукта Значение свойства
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 60
JESD-30 Code R-PBGA-B60
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.07 mA
Organization 64MX16
Output Characteristics 3-STATE
Seated Height-Max 1 mm
Memory Width 16
Standby Current-Max 0.0004 A
Memory Density 1073741824 bit
I/O Type COMMON
Memory IC Type DDR1 DRAM
Refresh Cycles 8192
Sequential Burst Length 2,4,8
Interleaved Burst Length 2,4,8
Access Mode FOUR BANK PAGE BURST
Self Refresh YES
Length 12 mm
Width 8 mm
Просмотр сходства

H5MS1G62MFP-L3M Документы

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