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H5TQ1G63AFP-G8C Технические параметры

SK Hynix Inc  H5TQ1G63AFP-G8C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 96Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description TFBGA, BGA96,9X16,32
Access Time-Max 0.15 ns
Clock Frequency-Max (fCLK) 533 MHz
Number of Words 67108864 wordsWord
Number of Words Code 64000000Words Codes
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.5 V
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.32
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Свойство продукта Значение свойства
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Pin Count 96
JESD-30 Code R-PBGA-B96
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.425 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.355 mA
Organization 64MX16
Output Characteristics 3-STATE
Seated Height-Max 1.1 mm
Memory Width 16
Standby Current-Max 0.01 A
Memory Density 1073741824 bit
I/O Type COMMON
Memory IC Type DDR3 DRAM
Refresh Cycles 8192
Sequential Burst Length 4,8
Interleaved Burst Length 4,8
Access Mode MULTI BANK PAGE BURST
Self Refresh YES
Length 13 mm
Width 8 mm
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H5TQ1G63AFP-G8C Документы

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