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HY27US08561M-TEB Технические параметры

SK Hynix Inc  HY27US08561M-TEB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory - Modules
Марка
Surface Mount YES
Number of Terminals 48Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code TSOP1
Package Description TSOP1,
Access Time-Max 10000 ns
Number of Words 33554432 wordsWord
Number of Words Code 32000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Supply Voltage-Nom (Vsup) 3.3 V
ECCN Code EAR99
Type SLC NAND TYPE
HTS Code 8542.32.00.51
Terminal Position DUAL
Свойство продукта Значение свойства
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 48
JESD-30 Code R-PDSO-G48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Organization 32MX8
Seated Height-Max 1.2 mm
Memory Width 8
Memory Density 268435456 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3.3 V
Length 18.4 mm
Width 12 mm
Просмотр сходства

HY27US08561M-TEB Документы

HY27US08561M-TEB brand manufacturers: SK Hynix Inc, Anli stock, HY27US08561M-TEB reference price.SK Hynix Inc. HY27US08561M-TEB parameters, HY27US08561M-TEB Datasheet PDF and pin diagram description download.You can use the HY27US08561M-TEB Memory - Modules, DSP Datesheet PDF, find HY27US08561M-TEB pin diagram and circuit diagram and usage method of function,HY27US08561M-TEB electronics tutorials.You can download from the Anli.