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HY5DU561622DF-J Технические параметры

SK Hynix Inc  HY5DU561622DF-J technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 60Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description TBGA, BGA60,9X12,40/32
Access Time-Max 0.7 ns
Clock Frequency-Max (fCLK) 166 MHz
Number of Words 16777216 wordsWord
Number of Words Code 16000000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA60,9X12,40/32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Supply Voltage-Nom (Vsup) 2.5 V
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.24
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Свойство продукта Значение свойства
Terminal Pitch 1 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 60
JESD-30 Code R-PBGA-B60
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.7 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.3 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.24 mA
Organization 16MX16
Output Characteristics 3-STATE
Seated Height-Max 1.17 mm
Memory Width 16
Standby Current-Max 0.01 A
Memory Density 268435456 bit
I/O Type COMMON
Memory IC Type DDR1 DRAM
Refresh Cycles 8192
Sequential Burst Length 2,4,8
Interleaved Burst Length 2,4,8
Access Mode FOUR BANK PAGE BURST
Self Refresh YES
Length 13 mm
Width 8 mm
Просмотр сходства

HY5DU561622DF-J Документы

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